Twistronics Unveiled: Unleashing Graphene’s Power with Ribbons of Innovation
Staff Editor Mumbai University has now developed a groundbreaking technique that allows for a systematic evaluation of twist angle and strain in layered 2D materials, unlocking the full potential of twistronics.
Twistronics, a term coined by Nobel laureate Andre Geim, refers to the study of how the properties of 2D materials can be manipulated by twisting them at specific angles. Graphene, a single layer of carbon atoms arranged in a hexagonal lattice, is one such material that has captured the attention of scientists due to its exceptional mechanical and electrical properties. By twisting the layers of graphene, researchers can create a moiré pattern, which alters the electronic behavior of the material.
Until now, the evaluation of twist angle and strain in 2D materials has been challenging, limiting the progress in twistronics research. However, the team at Columbia University has developed a technique that overcomes this hurdle. By using ribbons of graphene, the researchers were able to stretch and twist the material in a controlled manner, allowing for precise measurements of twist angle and strain.
This breakthrough has significant implications for the future of twistronics and the development of new electronic devices. By understanding how different twist angles and strains affect the properties of 2D materials, researchers can design materials with tailored properties for specific applications. This could lead to advancements in areas such as flexible electronics, energy storage, and quantum computing.
The development of this new technique at Columbia University marks a significant step forward in the field of twistronics. By providing a systematic evaluation of twist angle and strain in layered 2D materials, researchers can now unlock the full potential of these materials and pave the way for exciting advancements in various industries. The future of twistronics looks promising as scientists continue to explore the possibilities of manipulating 2D materials for groundbreaking applications.
